Form：HuaWei 2017/8/17Browse：4831

With Huawei Mate 10 will be released in mid-October news, this new machine equipped with the Kirin 970 processor, naturally became a lot of people concerned about the topic.

Form：Nordic 2017/8/16Browse：4599

The solution includes a support for 20 links, multi-role, Bluetooth 5 certified S132 v5.0 protocol stack, in all role combinations to provide full-link concurrent.

Form：Silicon Labs 2017/8/10Browse：5085

Silicon Labs (also known as "Core Technology") has launched the industry's most scalable, flexible and cost-effective car radio solution for the global automotive infotainment market.

Form：Bourns 2017/8/7Browse：4115

Bourns, a leading global supplier of electronic components, announced the addition of a new force to its award-winning Multifuse products - AEC-Q200 certified high temperature polymer polymer positive temperature coefficient (PPTC) self-healing fuse.

Form： Wireless Gecko 2017/6/19Browse：4826

Silicon Labs (also known as "Core Technology") has introduced a new multi-band SoC that supports full Bluetooth 5 connectivity and more storage capacity options to further expand its Wireless Gecko system single-chip (SoC) product line.

Form：CSOT 2017/6/14Browse：4961

On the morning of June 13, the total investment of 35 billion yuan Wuhan Huaxing photoelectric 6th generation flexible LTPS-AMOLED production line (Huaxing photoelectric t4 project), in the optical Valley intelligent manufacturing industry park started.

Form：Global Foundries 2017/6/14Browse：4404

Today announced the availability of its 7nm lead performance (7LP) FinFET semiconductor technology, with 40% of the leapfrog performance boost to meet the needs of applications such as high-end mobile processors, cloud servers and network infrastructures. Design Suite is now ready, based on 7LP technology, the first batch of customer products is expected to launch in the first half of 2018, and will be the second half of 2018 to achieve mass production.